International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9103Tsuyoshi YamamotoCDIS2014-102017

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/1020/RR pdf file 77 kB
2011-11-22 
1CD
91/1056/CD pdf file 1233 kB
2012-09-072012-06-30
ACDV
91/1087/CC pdf file 148 kB
2013-02-062013-02-28
CCDV
91/1090/CDV
pdf file 704 kB
pdf file 779 kB
2013-05-152013-05-31
ADIS
91/1150/RVC doc file 178 kB
pdf file 110 kB
2013-11-072013-11-15
DEC
2014-03-312014-02-28
RDIS
2014-04-082014-04-15
CDIS
91/1188/FDIS

2014-06-202014-06-30
APUB
 2014-08-31
BPUB
 2014-09-15
PPUB
 2014-10-15

Project

IEC 62137-4 Ed. 1.0

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

 

Remark:

This project when published will replace IEC 62137 Ed.1. Function concerned - Quality assurance. Project plan - CDV: 2013-03, FDIS: 2014-03

 

Associated Documents:

112/164/RM