International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9103Kaichi TsurutaRDIS2015-022017

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/1021/RR pdf file 77 kB
2011-11-22 
1CD
91/1071/CD pdf file 592 kB
2012-11-082012-06-30
ACDV
91/1113/CC doc file 104 kB
pdf file 79 kB
2013-07-192013-03-31
CCDV
91/1122/CDV
pdf file 560 kB
pdf file 665 kB
2013-10-022013-09-30
ADIS
91/1179/RVC doc file 109 kB
pdf file 55 kB
2014-03-212014-04-15
DEC
2014-08-012014-06-30
RDIS
2014-08-132014-08-31
CDIS
 2014-11-15
APUB
 2015-01-15
BPUB
 2015-01-31
PPUB
 2015-02-28

Project

IEC 61189-5-3 Ed. 1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste

 

Remark:

Function concerned - Quality assurance. Project plan - CDV: 2013-03, FDIS: 2014-03