International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9110Kunio TakaharaACDV2016-012020

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/929/NP pdf file 1337 kB
2010-06-18 
ANW
91/954/RVN pdf file 213 kB
2010-10-152010-11-15
1CD
91/1003/CD pdf file 80 kB
2011-09-022011-03-31
A2CD
91/1131/CC doc file 356 kB
pdf file 92 kB
2013-08-062013-07-31
2CD
91/1132/CD pdf file 172 kB
2013-08-072013-09-30
A3CD
91/1161/CC doc file 119 kB
pdf file 63 kB
2014-01-102014-09-30
3CD
91/1186/CD pdf file 389 kB
2014-04-182014-04-30
ACDV
91/1213/CC doc file 106 kB
pdf file 52 kB
2014-09-262014-07-31
CCDV
 2014-12-31

Project

IEC 61189-3-913 Ed. 1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs

 

Remark:

SMB/5436/DL - CCDV: 2014-12-31, FDIS: 2015-10-31. SMB/5256/DL - CCDV: 2014-11-30. Change of target date of A3CD to 2014-04 based on decision taken at TC 91 meeting in Richardson, Texas, USA on 2013-10-11. SMB/5155/DL - CCDV: 2014-08-31, FDIS: 2015-05-31. SMB/4881/DL - CCDV: 2013-07-31, FDIS: 2014-04-30 Former IEC 62689 Ed.1 IEC/PAS 62689 in // CDV: 2012-03 FDIS: 2013-03 IS: 2014-03 Liaison organizations: IPC, JEITA, JIEP, JPCA

 

Associated Documents:

SMB/4881/DL

SMB/5155/DL

SMB/5436/DL