International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91WG 10Udo WelzelPPUB2016-012020

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/1028/NP PDF file 985 kB
2012-02-20 
ANW
91/1076/RVN PDF file 129 kB
2012-11-272012-07-15
1CD
91/1152/CD PDF file 404 kB
2013-11-112013-11-30
ACDV
91/1167/CC Word file 114 kB
PDF file 117 kB
2014-02-122014-02-28
CCDV
91/1189/CDV
PDF file 327 kB
PDF file 265 kB
2014-09-122014-10-31
ADIS
91/1234/RVC Word file 122 kB
PDF file 60 kB
2015-01-092015-03-15
DEC
2015-07-242015-03-31
RDIS
2015-08-032015-08-15
CDIS
91/1303/FDIS

2015-09-252015-10-31
APUB
91/1327/RVD PDF file 140 kB
2015-12-022015-11-30
APUB
91/1327/RVD PDF file 140 kB
2015-12-02 
BPUB
2015-12-032015-12-15
BPUB
2015-12-03 
PPUB
2016-01-052016-01-15

Project

IEC 61189-3-719 Ed. 1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

 

Remark:

Function concerned - Quality assurance. SMB/5155/DL - 1CD: 2013-11-30. Project plan - CDV: 2013-12, FDIS: 2014-09.

 

Associated Documents:

SMB/5155/DL