International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 10 | Mr. H. Oka | DEL |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2012-03-22 | ||||
| DEL | 2012-11-30 | |||||
| ANW | 2012-08-15 | |||||
3742 kBProject
PNW 91-1035 Ed. 1.0
Future IEC 61189-3-720: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Electrochemical migration test method
Remark:
Project cancelled based on decision taken at TC 91 meeting in Fukuoka, Japan on 2012-10-19 (see 91/1077/RM). Project plan - CD: 2012-07, IS: 2014-07
Associated Documents:
91/1077/RM