International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 06 | Mr. M. Aoki | 1CD | 2015-03 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW |
| 2011-08-31 | ||||||
| ANW |
| 2012-03-22 | 2012-08-15 | |||||
| 1CD |
| 2013-01-23 | 2013-01-31 | |||||
| A2CD | 2013-04-30 | |||||||
2458 kBProject
IEC/TS 62326-17 Ed. 1.0
Printed boards - Part 17: Device embedded substrates - TEG (test element group)
Remark:
Project plan - CDV: 2013-09, FDIS: 2014-06 Relevant docs: Future 62326-16, 18 and 19 Liaison: IPC, JEITA, JIEP, JPCA