International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 03 | H. Nishikawa | CDIS | 2013-07 | 2018 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2011-02-18 | ||||
| ANW |
| 2011-06-24 | 2011-07-15 | |||
| 1CD |
| 2011-07-15 | 2011-07-15 | |||
| ACDV |
| 2011-10-31 | 2011-10-21 | |||
| CCDV |
| 2012-03-08 | 2012-02-28 | |||
| ADIS |
| 2012-12-03 | 2012-12-31 | |||
| DEC | 2013-01-23 | 2013-02-28 | ||||
| RDIS | 2013-01-29 | 2013-02-15 | ||||
| CDIS |
| 2013-03-22 | 2013-04-30 | |||
| APUB | 2013-05-31 | |||||
| BPUB | 2013-06-15 | |||||
| PPUB | 2013-07-15 | |||||
383 kB
104 kBProject
IEC 62739-1 Ed. 1.0
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
Remark:
Functions concerned - Quality assurance Project plan - CDV: 2012-04, FDIS: 2013-01.