International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 06 | Dr. HyunHo Kim | 2CD | 2013-12 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW |
| 2010-02-26 | ||||||
| ANW |
| 2010-08-06 | 2010-07-15 | |||||
| 1CD |
| 2011-08-25 | 2011-03-31 | |||||
| A2CD |
| 2012-08-24 | 2012-01-06 | |||||
| 2CD |
| 2012-08-24 | 2012-09-30 | |||||
| A3CD | 2013-07-31 | |||||||
752 kB
226 kBProject
IEC 62326-15 Ed. 1.0
Printed boards - Device Embedded Substrate - General electrical test guide for device embedded substrate with active devices,passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages.
Remark:
SMB/4881/DL - 2CD: 2012-09-30, CCDV: 2013-04-30, FDIS: 2014-01-31 Project plan - CDV: 2012-03; FDIS: 2013-03 Liaison organizations: KPCA, IPC, JIEP, JEITA, JPCA Relevant documents to be considered: 91/893A/PAS, 91/894A/NP
Associated Documents:
SMB/4881/DL