International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 03 | T. Yamamoto | 1CD | 2014-09 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| AMW |
| 2011-11-22 | ||||
| 1CD |
| 2012-09-07 | 2012-06-30 | |||
| A2CD | 2013-02-28 | |||||
77 kBProject
IEC 62137-4 Ed. 1.0
Review report on IEC 62137-4 Ed.1: Electronics assembly technology - Part 4: Environmental and endurance test methods for solder joint of area array type package surface mount devices
Remark:
This project when published will replace IEC 62137 Ed.1. Function concerned - Quality assurance. Project plan - CDV: 2013-03, FDIS: 2014-03
Associated Documents:
112/164/RM