International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 04 | D.J. SOBER | ADIS | 2013-09 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2008-03-07 | ||||
| ANW |
| 2008-08-01 | 2008-07-31 | |||
| 1CD |
| 2010-09-24 | 2010-03-31 | |||
| ACDV |
| 2011-02-18 | 2010-12-31 | |||
| CCDV |
| 2011-04-08 | 2011-04-30 | |||
| ADIS |
| 2011-09-15 | 2011-12-15 | |||
| DEC | 2013-04-30 | |||||
184 kB
153 kBProject
IEC 61249-4-19 Ed. 1.0
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Remark:
SMB/4881/DL - FDIS: 2013-04-30
Associated Documents:
SMB/4881/DL