International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 02 | K. Tsuruta | CCDV | 2013-09 | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| AMW |
| 2011-11-08 | ||||||
| 1CD |
| 2011-12-22 | 2011-11-30 | |||||
| ACDV |
| 2012-05-23 | 2012-04-30 | |||||
| CCDV |
| 2012-05-31 | 2012-07-31 | |||||
| ADIS | 2013-01-31 | |||||||
| DEC | 2013-03-15 | |||||||
76 kB
118 kBProject
IEC 61190-1-2 am1 Ed. 2.0
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high - quality interconnects in electronics assembly
Remark:
Function concerned - Quality assurance. Project plan - CDV: 2012-06, FDIS: 2013-03 Functions concerned - Quality assurance