International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 9102Kaichi TsurutaPPUB2014-032020

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/1019/RR pdf file 76 kB
2011-11-08 
1CD
91/1023/CD pdf file 839 kB
2011-12-222011-11-30
ACDV
91/1042/CC doc file 118 kB
pdf file 126 kB
2012-05-232012-04-30
CCDV
91/1043/CDV pdf file 816 kB
pdf file 831 kB
91/1043F/CDV pdf file 831 kB
2012-05-312012-07-31
ADIS
91/1120/RVC doc file 170 kB
pdf file 124 kB
2013-07-232013-01-31
DEC
2013-09-162013-09-30
RDIS
2013-09-272013-10-15
CDIS
91/1154/FDIS

91/1154A/FDIS

2013-11-272013-12-31
APUB
91/1166/RVD pdf file 476 kB
2014-02-032014-01-31
BPUB
2014-02-042014-02-15
PPUB
2014-02-192014-03-15

Project

IEC 61190-1-2 Ed. 3.0

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

 

Remark:

Previous project number was IEC 61190-1-2 Am.1 Ed.2. Function concerned - Quality assurance. Project plan - CDV: 2012-06, FDIS: 2013-03 Functions concerned - Quality assurance