International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 03 | G. Naisbitt | 1CD | 2014-09 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| AMW |
| 2011-11-22 | ||||
| 1CD |
| 2012-11-08 | 2012-06-30 | |||
| A2CD | 2013-03-31 | |||||
77 kBProject
IEC 61189-5-4 Ed. 1.0
Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies - Solder alloys and fluxed and non-fluxed solid wire
Remark:
Function concerned - Quality assurance. Project plan - CDV: 2013-03, FDIS: 2014-03