International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9103Kaichi TsurutaADIS2014-112017

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/1021/RR pdf file 77 kB
2011-11-22 
1CD
91/1072/CD pdf file 279 kB
2012-11-082012-06-30
ACDV
91/1114/CC doc file 91 kB
pdf file 49 kB
2013-07-192013-03-31
CCDV
91/1123/CDV
pdf file 217 kB
pdf file 233 kB
2013-10-022013-09-30
ADIS
91/1180/RVC doc file 101 kB
pdf file 54 kB
2014-03-212014-04-15
DEC
 2014-06-30

Project

IEC 61189-5-4 Ed. 1.0

Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire

 

Remark:

Function concerned - Quality assurance. Project plan - CDV: 2013-03, FDIS: 2014-03