International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 10 | Mr. M. Aoki | 1CD | 2014-03 | 2014 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2010-06-18 | ||||
| ANW |
| 2010-10-15 | 2010-11-15 | |||
| 1CD |
| 2011-09-02 | 2011-03-31 | |||
| A2CD | 2013-07-31 | |||||
1337 kBProject
IEC 61189-3-913 Ed. 1.0
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test methods for interconnection structures (printed boards) -Test methods for electronic circuit board for high-brightness LEDs
Remark:
SMB/4881/DL - CCDV: 2013-07-31, FDIS: 2014-04-30 Former IEC 62689 Ed.1 IEC/PAS 62689 in // CDV: 2012-03 FDIS: 2013-03 IS: 2014-03 Liaison organizations: IPC, JEITA, JIEP, JPCA
Associated Documents:
SMB/4881/DL