International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 10 | U. Welzel | ANW | 2014-06 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2012-02-20 | ||||
| ANW |
| 2012-11-27 | 2012-07-15 | |||
| 1CD | 2012-12-31 | |||||
985 kBProject
IEC 61189-3-719 Ed. 1.0
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling
Remark:
Project plan - CDV: 2013-12, FDIS: 2014-09.