Electronics assembly technology
|TC 91||10||K. Ikeda||DEL||2012-03|
IEC 61189-2-720 Ed. 1.0
Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz)
- Project cancelled based on decision taken at the plenary meeting in Fukuoka, Japan on 2012-10-19. - SMB/4747/DL - 1CD: 2012-08-31, CCDV: 2013-03-31 - Please refer to SMB/4343/DL, SMB/4536/DL. - PPUB: 2013-06-30 - Project plan: CDV: 2010-09, FDIS: 2011-09 - Relevant documents: IEC 61189-2.