International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 10 | K. Ikeda | DEL | 2012-03 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2008-08-29 | ||||
| ANW |
| 2009-08-21 | 2009-01-15 | |||
| DEL | 2012-10-19 | 2012-08-31 | ||||
237 kBProject
IEC 61189-2-719 Ed. 1.0
Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz)
Remark:
- Project cancelled based on decision taken at the plenary meeting in Fukuoka, Japan on 2012-10-19. - SMB/4747/DL - 1CD: 2012-08-31, CCDV: 2013-03-31 - Please refer to SMB/4343/DL, SMB/4536/DL. - PPUB: 2013-06-30 - Project plan: CD: 2009-12,CDV: 2010-09, FDIS: 2011-09, IS: 2012-03 - Relevant documents: IEC 61189-2.
Associated Documents:
SMB/4536/DL