International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9110Prof. M. LeeDEL2015-03 

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/1000/NP pdf file 394 kB
2011-08-31 
ANW
91/1027/RVN pdf file 155 kB
2012-02-152012-01-15
DEL
2013-10-11 

Project

IEC 61189-2-629 Ed. 1.0

Test method of adhesion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application

 

Remark:

Project deleted based on decision taken at TC 91 meeting in Richardson, Texas, USA on 2013-10-11 Project plan - CDV: 2013-09, FDIS: 2014-06

 

Associated Documents:

SMB/4961/R