International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 10 | Prof. M. Lee | ANW | 2015-03 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2011-08-31 | ||||
| ANW |
| 2012-02-15 | 2012-01-15 | |||
| 1CD | 2012-09-30 | |||||
394 kBProject
IEC 61189-2-629 Ed. 1.0
Test method of adhesion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application
Remark:
Project plan - CDV: 2013-09, FDIS: 2014-06