Electronics assembly technology
|TC 91||10||K. Ikeda||DEL||2012-03|
IEC 61189-2-628 Ed. 1.0
IEC 61189-2-628,Ed.1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis(DMA; bend and pull)
- Project cancelled based on decision taken at the plenary meeting in Fukuoka, Japan on 2012-10-19. - SMB/4747/DL - 1CD: 2012-08-31, CCDV: 2013-03-31 - Please refer to SMB/4343/DL, SMB/4536/DL. - PPUB: 2013-06-30 - Project plan: CD: 2009-12, CDV: 2010, FDIS: 2011-09, IS: 2012-03 - Relevant documents: IEC 61189-2.