International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 9110K. IkedaDEL2012-03 

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/805/NP pdf file 182 kB
2008-08-29 
ANW
91/873/RVN pdf file 228 kB
2009-08-212009-01-15
DEL
2012-10-192012-08-31

Project

IEC 61189-2-628 Ed. 1.0

IEC 61189-2-628,Ed.1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis(DMA; bend and pull)

 

Remark:

- Project cancelled based on decision taken at the plenary meeting in Fukuoka, Japan on 2012-10-19. - SMB/4747/DL - 1CD: 2012-08-31, CCDV: 2013-03-31 - Please refer to SMB/4343/DL, SMB/4536/DL. - PPUB: 2013-06-30 - Project plan: CD: 2009-12, CDV: 2010, FDIS: 2011-09, IS: 2012-03 - Relevant documents: IEC 61189-2.

 

Associated Documents:

SMB/4536/DL