International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 03 | Koichi Hagio | CDIS | 2013-05 | 2016 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2008-10-10 | ||||
| ANW |
| 2009-05-08 | 2009-02-28 | |||
| 1CD |
| 2009-08-14 | 2009-06-30 | |||
| A2CD |
| 2010-06-25 | 2009-12-31 | |||
| 2CD |
| 2011-02-25 | 2010-07-31 | |||
| ACDV |
| 2011-06-10 | 2011-05-31 | |||
| CCDV |
| 2011-09-07 | 2011-07-31 | |||
| ADIS |
| 2012-04-19 | 2012-05-15 | |||
| DEC | 2012-11-19 | 2012-08-31 | ||||
| RDIS | 2012-11-28 | 2012-12-15 | ||||
| CDIS |
| 2013-02-07 | 2013-02-28 | |||
| APUB | 2013-04-15 | |||||
| BPUB | 2013-04-30 | |||||
| PPUB | 2013-05-31 | |||||
226 kB
176 kBProject
IEC 61189-11 Ed. 1.0
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
Remark:
Function concerned - Quality assurance. Targets - CDV: 2010-06 FDIS: 2011-06