International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 03 | G. Naisbitt | AMW | 2014-02 |
History
78 kBProject
IEC 60068-2-69 Ed. 3.0
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronics components for surface mounting devices (SMD) by the wetting balance method
Remark:
SMB/4976/DL - 1CD: 2013-01-31, CCDV: 2014-02-28 Project plan - CDV: 2012-11, FDIS: 2013-08
Associated Documents:
SMB/4976/DL