International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 03 | Mr Msashi Aoki | 3CD | 2013-03 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| AMW |
| 2011-02-11 | ||||
| 1CD |
| 2011-02-12 | 2011-02-28 | |||
| A2CD |
| 2011-06-17 | 2011-06-30 | |||
| 2CD |
| 2011-10-28 | 2011-08-30 | |||
| A3CD |
| 2012-08-24 | 2012-03-31 | |||
| 3CD |
| 2012-08-24 | 2012-08-31 | |||
| A4CD | 2012-12-31 | |||||
39 kB
554 kBProject
IEC 60068-2-58 Ed. 4.0
ENVIRONMENTAL TESTING - Part 2-58: Tests - Test Td- Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD))
Remark:
SMB/4881/DL - CCDV: 2013-03-31, FDIS: 2013-12-31 Function concerned - Quality assurance
Associated Documents:
SMB/4881/DL