International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 4705H. MatsuyamaACDV2016-05 

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47/2157/NP pdf file 968 kB
2012-12-21 
ANW
47/2176/RVN pdf file 7 kB
47/2176A/RVN doc file 142 kB
pdf file 98 kB
2013-06-262013-05-15
1CD
47/2191/CD pdf file 904 kB
2014-01-222014-04-30
ACDV
47/2201/CC doc file 213 kB
pdf file 130 kB
2014-05-232014-05-31
CCDV
 2015-01-31

Project

IEC 62880-1 Ed. 1.0

Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method

 

Remark:

Project plan - CDV: 2015-03, FDIS: 2016-01. Liaison - JEITA/EIA and JEITA