International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Techniques d'assemblage des composants électroniques |
Détail
Comité | Groupes de Travail | Chef de Projet | Statut Courant | Frcst Pub Date | Date Stabilité |
|---|---|---|---|---|---|
| TC 91 | 01 | R. Derksen | PPUB | 2007-03 | 2015 |
Historique
Stage | Document | Downloads | Date de Décision | Date Cible | ||||
|---|---|---|---|---|---|---|---|---|
| AMW |
| 2004-05-28 | ||||||
| 1CD |
| 2004-06-04 | 2004-07-31 | |||||
| CDM |
| 2005-08-26 | 2004-10-31 | |||||
| ACDV |
| 2005-11-11 | 2005-11-15 | |||||
| CCDV |
| 2005-11-25 | 2005-11-30 | |||||
| APUB |
| 2006-09-22 | 2006-07-31 | |||||
| BPUB | 2007-01-24 | 2006-11-30 | ||||||
| DEC | 2007-02-02 | 2007-02-28 | ||||||
| BPUB | 2007-02-12 | 2007-02-28 | ||||||
| PPUB | 2007-04-24 | 2007-04-30 | ||||||
57 kBProjet
IEC 61760-2 Ed. 2.0
Technique du montage en surface - Partie 2: Conditions de transport et stockage des composants pour montage en surface (CMS) - Guide d'application
Remarque:
- Targets: CCDV: 2005-07, CDIS: 2006-07 - No comments on CDV -> direct publication