International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Systèmes microélectromécaniques

 

Détail

Comité
Groupes de Travail
Chef de Projet

Statut

Courant

Frcst Pub
Date

Date

Stabilité

SC 47F01Seungmin Hyun,Yong-Hak HuhCCDV2014-122017

Historique

Stage
Document
Downloads
Date de Décision
Date Cible
PNW
47F/46/NP pdf file 1040 kB
2010-02-26 
ANW
47F/58/RVN pdf file 266 kB
47F/58A/RVN pdf file 268 kB
2010-07-092010-07-15
1CD
47F/78/CD pdf file 840 kB
2011-03-042010-11-30
CDM
47F/101/CC doc file 300 kB
pdf file 255 kB
47F/101A/CC doc file 338 kB
pdf file 237 kB
2011-09-08 
A2CD
47F/101/CC doc file 300 kB
pdf file 255 kB
47F/101A/CC doc file 338 kB
pdf file 237 kB
2012-03-012011-11-30
2CD
47F/121/CD pdf file 776 kB
2012-03-02 
CDM
47F/132/CC doc file 125 kB
pdf file 164 kB
47F/132A/CC doc file 138 kB
pdf file 188 kB
2012-09-202012-07-31
A3CD
47F/132/CC doc file 125 kB
pdf file 164 kB
47F/132A/CC doc file 138 kB
pdf file 188 kB
2012-12-182012-11-30
3CD
47F/146/CD pdf file 563 kB
2013-01-072013-02-28
ACDV
47F/165/CC doc file 220 kB
pdf file 186 kB
2013-08-072013-05-31
CCDV
47F/166/CDV
pdf file 582 kB
pdf file 581 kB
2013-10-252013-11-30
ADIS
 2014-04-30
DEC
 2014-05-31

Projet

IEC 62047-17 Ed. 1.0

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 17: Méthode d'essai de renflement pour la mesure des propriétés mécaniques des couches minces

 

Remarque:

SMB/4976/DL - 3CD: 2013-01-31 Project plan: CDV: 2011-10 FDIS: 2012-09 IS: 2013-06 Relevant Documents: IEC 62047-1, Micro electromechanical devices - Terms and definitions. IEC 62047-2, Micro electromechanical devices - Tensile testing method of thin film materials. IEC 62047-3, Micro electromechanical devices - Thin film standard test piece

 

Document Associés:

SMB/4976/DL