International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9103H. KasugaPPUB 2017

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/161/NP pdf file 659 kB
1998-10-02 
ANW
91/179/RVN pdf file 19 kB
1999-08-271999-02-28
1CD
91/227/CD pdf file 188 kB
2001-03-162001-03-31
ACDV
91/309/CC pdf file 210 kB
2002-05-242001-07-31
CCDV
91/319/CDV pdf file 388 kB
2002-06-142002-07-31
ADIS
91/368/RVC pdf file 120 kB
2003-01-242003-02-15
DEC
2004-01-072003-07-31
RDIS
2004-01-202004-02-15
CDIS
91/444/FDIS
2004-03-052004-04-30
APUB
91/451/RVD pdf file 80 kB
2004-05-112004-07-31
BPUB
2004-05-122004-08-31
PPUB
2004-07-062004-09-30

Project

IEC 62137 Ed. 1.0

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

 

Remark:

- Proj. will be integrated at CDV stage to Proj. 61189-5 - Liaison IPC (D liaison with TC91), EIAJ, CLC - CA decision (mtg: 01-02-08) extension CD target date accepted - MRD extended per decision in London mtg, 2006-10 and Seoul, 2007-10

 

Associated Documents:

CA/1959/DL