International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9104 PPUB 2013

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
1989-11-01 
ANW
1989-11-16 
1CD
52(SEC.)/352/CD  
1991-11-01 
CCDV
52(SEC.)/440/CDV  
1993-09-03 
ADIS
52(SEC.)/500/RVC  
1994-06-17 
RDIS
1995-03-091995-01-01
CDIS
52/544/DIS  
1995-05-26 
APUB
52/606/RVD  
1995-10-171995-10-31
BPUB
1995-10-181995-11-30
PPUB
1995-11-281996-01-31

Project

IEC 61249-5-1 Ed. 1.0

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

 

Remark:

- Incorporating IEC 249-3A. - IEC 1249 series will replace IEC 249 series - MRD extended as per decision in London mtg, 2006-10 and Seoul, 2007-10