International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 9104D.J. SOBERPPUB2013-102017

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/759/NP pdf file 184 kB
2008-03-07 
ANW
91/792/RVN pdf file 180 kB
2008-08-012008-07-31
1CD
91/951/CD pdf file 263 kB
2010-09-242010-03-31
ACDV
91/967/CC doc file 153 kB
pdf file 231 kB
2011-02-182010-12-31
CCDV
91/973/CDV pdf file 267 kB
pdf file 273 kB
2011-04-082011-04-30
ADIS
91/1010/RVC pdf file 19 kB
91/1010A/RVC doc file 127 kB
pdf file 200 kB
2011-09-152011-12-15
DEC
2013-06-242013-04-30
RDIS
2013-07-012013-07-15
CDIS
91/1126/FDIS

2013-07-312013-09-30
APUB
91/1148/RVD pdf file 54 kB
2013-10-072013-10-15
BPUB
2013-10-082013-10-31
PPUB
2013-11-042013-11-30

Project

IEC 61249-4-19 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

 

Remark:

SMB/4881/DL - FDIS: 2013-04-30

 

Associated Documents:

SMB/4881/DL