International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 9104D.J. SOBERPPUB2009-062014

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/668/NP pdf file 184 kB
2007-04-06 
ANW
91/721/RVN pdf file 123 kB
2007-08-242007-08-31
CCDV
91/669/CDV pdf file 174 kB
2007-08-25 
ADIS
91/731/RVC pdf file 246 kB
91/731A/RVC pdf file 241 kB
2007-09-282007-12-15
DEC
2009-01-222009-01-31
RDIS
2009-02-022009-02-15
CDIS
91/853/FDIS
2009-02-272009-04-30
APUB
91/865/RVD pdf file 28 kB
2009-05-062009-04-30
BPUB
2009-05-072009-05-15
PPUB
2009-05-262009-06-15

Project

IEC 61249-4-17 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

 

Remark:

SMB/3860/DL - RDIS: 2008-10 PR re-submit with NP running in // with CDV

 

Associated Documents:

SMB/3860/DL