International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9102Kaichi TsurutaPPUB2010-062014

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/808/MCR pdf file 87 kB
2008-08-29 
1CD
91/809/CD pdf file 229 kB
2008-09-052008-09-30
ACDV
91/839/CC pdf file 175 kB
2009-01-092009-01-31
CCDV
91/847/CDV pdf file 153 kB
pdf file 177 kB
91/847F/CDV pdf file 177 kB
2009-02-062009-01-31
CCDV
91/847/CDV pdf file 153 kB
pdf file 177 kB
91/847F/CDV pdf file 177 kB
2009-03-272009-03-15
ADIS
91/899/RVC pdf file 217 kB
2009-10-302009-10-15
DEC
2010-02-082009-11-30
RDIS
2010-02-162010-02-28
CDIS
91/920/FDIS

2010-03-122010-05-15
APUB
91/925/RVD pdf file 210 kB
2010-05-172010-05-15
BPUB
2010-05-182010-05-31
PPUB
2010-06-102010-06-30

Project

IEC 61190-1-3 am1 Ed. 2.0

Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

 

Remark:

Project plan: CDV: 2009-07, FDIS: 2009-10.