International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 91PT 61190Kaichi TsurutaDELPUB2007-042013

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
91/491/MCR pdf file 91 kB
2004-09-24 
1CD
91/520/CD pdf file 896 kB
2005-04-292004-11-30
ACDV
91/547/CC pdf file 134 kB
2005-09-022005-08-31
CCDV
91/567/CDV pdf file 914 kB
2005-11-252005-10-31
CDVM
91/603/RVC pdf file 151 kB
91/603A/RVC pdf file 177 kB
2006-05-122006-06-30
ADIS
91/603/RVC pdf file 151 kB
91/603A/RVC pdf file 177 kB
2006-10-062006-07-31
DEC
2006-10-272006-11-30
RDIS
2006-11-062006-12-15
CDIS
91/646/FDIS
2007-02-022007-02-28
APUB
91/678/RVD pdf file 100 kB
2007-04-132007-05-31
BPUB
2007-04-162007-06-30
PPUB
2007-04-262007-07-31
DELPUB
2014-02-19 

Project

IEC 61190-1-2 Ed. 2.0

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

 

Remark:

- targets: CCDV 2005-11, CDIS 2006-11 - This ed.2 PR will replace IEC 61190-1-6