International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9102Vern SolbergPPUB 2013

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/112/NP  
1997-02-14 
ANW
91/121/RVN  
1997-06-301997-06-30
ACDV
1997-10-31 
1CD
91/141/CD  
1998-06-261998-02-28
ACDV
91/166/CC  
91/166A/CC  
91/166B/CC pdf file 30 kB
1999-02-121998-10-30
CCDV
91/190/CDV pdf file 228 kB
2000-05-052000-04-30
ADIS
91/219/RVC pdf file 50 kB
2001-02-022001-01-31
DEC
2001-05-212001-05-31
ADISSB
2001-05-28 
DEC
2001-11-262001-09-14
RDIS
2001-11-262001-12-15
CDIS
91/277/FDIS

2001-12-142002-02-28
APUB
91/287/RVD pdf file 98 kB
2002-02-202002-03-15
BPUB
2002-02-212002-04-15
PPUB
2002-03-252002-04-30

Project

IEC 61190-1-1 Ed. 1.0

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

 

Remark:

- Liaison EIA/IPC, IEC/TC52, EIAJ, CECC - MRD extended as per decision in London mtg, 2006-10

 

Associated Documents:

91/137/RM

91/165/RM

CA/1789/DL