International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 4702Jim LYNCHPPUB2008-122016

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
47/1915/MCR pdf file 117 kB
2007-06-29 
CCDV
47/1916/CDV pdf file 422 kB
2007-06-29 
ADIS
47/1981/RVC pdf file 155 kB
2008-07-042008-02-29
DEC
2008-07-152008-09-30
RDIS
2008-07-182008-07-31
CDIS
47/1989/FDIS

2008-09-122008-10-15
APUB
47/2003/RVD pdf file 104 kB
2008-11-182008-11-15
BPUB
2008-11-192008-11-30
PPUB
2008-12-092008-12-31

Project

IEC 60749-20 Ed. 2.0

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

 

Remark:

- This revision is intended to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C