International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 4702Jim LYNCHPPUB 2016

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47/1421/NP  
1998-02-27 
ANW
47/1424/RVN  
1998-06-191998-07-15
1CD
47/1439/CD pdf file 1248 kB
1999-07-231999-11-30
ACDV
47/1523/CC pdf file 151 kB
2000-07-141999-12-31
CCDV
47/1615/CDV pdf file 3320 kB
2002-03-222002-02-28
ADIS
47/1688/RVC pdf file 203 kB
2003-02-052002-11-30
DEC
2003-02-052003-03-31
RDIS
2003-02-122003-02-28
CDIS
47/1701/FDIS

2003-04-252003-05-15
APUB
47/1707/RVD pdf file 101 kB
2003-07-032003-08-15
BPUB
2003-07-042003-09-15
PPUB
2003-08-072003-10-15

Project

IEC 60749-14 Ed. 1.0

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

 

Remark:

supersedes IEC/PAS 62184 (2000) - formerly IEC/PAS 62184: 47/1457/PAS, 47/1490/RVD B 105-B/JEDEC - cc: TC 104