International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 4702 CAN  

History

Stage
Document
Downloads
Decision Date
Target Date
CDPAS
47/1449/PAS  
2000-01-21 
APUB
47/1482/RVD  
47/1482A/RVD  
2000-04-102000-04-30
CAN
47/1482/RVD  
47/1482A/RVD  
2000-09-012000-05-30

Project

IEC/PAS 62176 Ed. 1.0

Wire bond shear test method

 

Remark:

- This PAS has been withdrawn acc. to AC/67/1999 as subject is covered by IEC 60749/A1