International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 4702Jim LynchPPUB2008-022016

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47/1753/NP pdf file 240 kB
2004-03-12 
ANW
47/1791/RVN pdf file 201 kB
47/1791A/RVN pdf file 138 kB
2004-10-082004-07-31
ANW
47/1791/RVN pdf file 201 kB
47/1791A/RVN pdf file 138 kB
2004-12-172004-10-31
1CD
47/1824/CD pdf file 370 kB
2005-06-242005-07-31
ACDV
47/1844/CC pdf file 169 kB
47/1844A/CC pdf file 525 kB
2005-10-282005-11-15
ACDV
47/1844/CC pdf file 169 kB
47/1844A/CC pdf file 525 kB
2005-10-282005-11-30
CCDV
47/1850/CDV pdf file 370 kB
pdf file 400 kB
2005-12-162005-11-30
CDVM
47/1888/RVC pdf file 445 kB
47/1888A/RVC pdf file 439 kB
2006-09-222006-08-31
ADIS
47/1888/RVC pdf file 445 kB
47/1888A/RVC pdf file 439 kB
2007-07-18 
DEC
2007-07-192006-12-31
RDIS
2007-08-062007-08-15
CDIS
47/1937/FDIS

2007-10-122007-10-31
APUB
47/1948/RVD pdf file 107 kB
2007-12-192007-12-15
BPUB
2007-12-202007-12-31
PPUB
2008-01-302008-01-31

Project

IEC 60749-37 Ed. 1.0

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

 

Remark:

- JP comments @ CD to be re submitted at CDV level - This JESD22-B11 - intended to become future IEC 60749-37 - Issued as IEC/PAS 62050 and also IEC PR in parallel 60749-37 - Targets: CCDV: 2006-03, CDIS, 2007-03