International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 4702James LynchPPUB 2015

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47/1455/PAS
2000-01-21 
ANW
47/1488/RVD pdf file 27 kB
2000-04-212000-06-15
1CD
47/1682/CD pdf file 170 kB
2003-01-10 
CDM
47/1721/CC pdf file 119 kB
47/1721A/CC pdf file 129 kB
2003-09-192003-05-31
ACDV
47/1721/CC pdf file 119 kB
47/1721A/CC pdf file 129 kB
2003-10-312003-11-15
CCDV
47/1739/CDV pdf file 191 kB
2003-11-212003-11-30
ADIS
47/1770/RVC pdf file 206 kB
2004-07-302004-07-31
RDIS
2004-08-112004-08-31
DEC
2004-08-112004-11-30
CDIS
47/1790/FDIS

2004-10-082004-11-15
APUB
47/1798/RVD pdf file 97 kB
2004-12-132005-02-15
BPUB
2004-12-142005-03-15
PPUB
2005-01-202005-04-15

Project

IEC 60749-30 Ed. 1.0

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

 

Remark:

- formerly IEC/PAS 62182 - JESD22-A113-B - Previous IEC proj No. 62182 - MRD revised as per decision in London, 2006-10