International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 4702Jim LYNCHPPUB2009-042018

History

Stage
Document
Downloads
Decision Date
Target Date
1CD
47/1775/CD pdf file 177 kB
2004-08-20 
CDM
47/1810/CC pdf file 173 kB
47/1810A/CC pdf file 145 kB
2005-03-112005-05-31
ACDV
47/1810/CC pdf file 173 kB
47/1810A/CC pdf file 145 kB
2007-06-012007-06-30
CCDV
47/1917/CDV pdf file 312 kB
2007-06-292007-09-15
ADIS
47/1986/RVC doc file 212 kB
pdf file 157 kB
2008-08-222008-02-29
DEC
2008-10-032008-10-31
RDIS
2008-10-132008-10-31
CDIS
47/2010/FDIS

2009-01-162009-01-15
APUB
47/2013/RVD pdf file 27 kB
2009-03-232009-03-31
BPUB
2009-03-242009-03-31
PPUB
2009-04-072009-04-30

Project

IEC 60749-20-1 Ed. 1.0

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

 

Remark:

- Ext of targets for ACDV: 2007-06, CCDV: 2007-09 - SMB/3445B/INF - CDV of IEC 60749-20-1 issued following the revision of IEC 60749-20 to Ed. 2 - This PR is based on general basic 47/1421/NP and 47/1424/RVN on complete update of IEC 60749. cc: TC 91, 101, 104 - Will replace IEC/PAS 62168 and 62169

 

Associated Documents:

47/1468/PAS

47/1469/PAS

47/1501/RVD

47/1502/RVD

SMB/3445B/INF