International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 02 | PPUB | 2014 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 1994-03-01 | ||||
| ANW |
| 1994-07-15 | ||||
| 1CD |
| 1996-07-26 | 1996-05-31 | |||
| ACDV | 1997-09-19 | 1997-09-30 | ||||
| CCDV |
| 1998-10-02 | 1997-12-31 | |||
| CDVM |
| 1999-05-07 | 1999-06-30 | |||
| ADIS | 1999-05-12 | 1999-12-31 | ||||
| DEC | 2000-02-01 | 2000-03-31 | ||||
| ADIS | 2000-02-02 | 2000-12-31 | ||||
| DEC | 2001-01-09 | 2001-01-31 | ||||
| ADISSB | 2001-01-16 | |||||
| RDIS | 2001-05-04 | 2001-05-31 | ||||
| DEC | 2001-05-04 | |||||
| CDIS |
| 2001-05-18 | 2001-08-15 | |||
| APUB |
| 2001-07-25 | 2001-08-31 | |||
| BPUB | 2001-07-26 | 2001-09-30 | ||||
| PPUB | 2001-08-27 | 2001-09-30 | ||||
399 kBProject
IEC 60191-6-8 Ed. 1.0
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
Remark:
- Validity date extended acc to decision at Munich 2005 - 47D/624/RM - Change of project no. - Former 60191-6/A1/f2/E1. - Change of project no. - Former 60191-6/A2/f2/E1. - US Sec. No: 2/99019
Associated Documents:
47D/96/RM