International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D02H. NakajimaPPUB 2016

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/126/NP  
1996-07-26 
ANW
47D/173/RVN  
47D/173A/RVN  
1996-12-151996-12-15
1CD
47D/195/CD  
1997-09-191998-12-31
ACDV
47D/257/CC  
1999-01-151998-06-30
CCDV
47D/313/CDV  
1999-07-231999-05-15
ADIS
47D/350/RVC  
2000-02-112000-03-31
DEC
2000-07-112000-07-31
ADISSB
2000-07-11 
DEC
2000-11-28 
RDIS
2000-12-052000-12-31
CDIS
47D/404/FDIS  
47D/404A/FDIS  
2000-12-222001-03-15
APUB
47D/421/RVD  
2001-02-122001-03-31
BPUB
2001-02-132001-07-15
PPUB
2001-03-222001-04-15

Project

IEC 60191-6-6 Ed. 1.0

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

 

Remark:

- Validity date extended acc to decision at Munich 2005 - 47D/624/RM - former project number: 60191-6/A2/f13 - US Sec. No: 2/99022