International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D02Hirofumi NakajimaDEL2013-122018

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
47D/751/MCR  
2009-08-21 
1CD
47D/755/CD  
2009-10-232009-10-31
ACDV
47D/767/CC  
2010-04-302010-02-28
CCDV
47D/781/CDV  
47D/781F/CDV  
2010-08-272010-06-30
ADIS
47D/794/RVC  
2011-04-012011-04-30
DEC
2012-02-012012-04-30
RDIS
2012-02-102012-02-29
CDIS
47D/829/FDIS  
2012-10-042012-05-15
NCD
47D/830/RVD  
47D/830A/RVD  
2012-12-132012-12-15
DEL
47D/830/RVD  
47D/830A/RVD  
2013-10-242013-06-30

Project

IEC 60191-6-5 Ed. 2.0

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

 

Remark:

CDV: 2010-05 FDIS: 2011-02