International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D02M. SonoPPUB 2020

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/130/NP  
1996-07-31 
DEL
47D/177/RVN  
47D/177A/RVN  
1996-12-141996-12-15
ANW
47D/177/RVN  
47D/177A/RVN  
1998-03-26 
1CD
47D/221/CDV  
1998-03-271998-03-30
CCDV
47D/221/CDV  
1998-03-271998-07-31
ACDV
47D/177/RVN  
47D/177A/RVN  
1998-03-27 
CDVM
47D/244/RVC  
1998-10-091998-11-30
ADIS
1999-05-121998-11-30
ADISSB
1999-12-20 
RDIS
2000-03-292000-04-15
CDIS
47D/370/FDIS
2000-04-212000-04-15
APUB
47D/388/RVD pdf file 49 kB
2000-07-262000-07-15
BPUB
2000-07-272000-08-15
PPUB
2000-09-292000-09-30

Project

IEC 60191-6-3 Ed. 1.0

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

 

Remark:

- Validity date extended acc to decision at Munich 2005 - 47D/624/RM - English only. - Change of project no. - Former 60191-6/A2/F7/E1.

 

Associated Documents:

47D/318/RM