International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | WG2 | Mr. Hirofumi Nakajima | PPUB | 2012-12 | 2022 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW |
| 2010-08-27 | ||||||
| ANW |
| 2011-04-08 | 2011-01-15 | |||||
| 1CD |
| 2011-05-27 | 2011-06-30 | |||||
| ACDV |
| 2011-09-14 | 2011-10-15 | |||||
| CCDV |
| 2011-11-24 | 2011-12-31 | |||||
| APUB |
| 2012-05-18 | 2012-07-31 | |||||
| DEC | 2012-10-05 | 2012-11-30 | ||||||
| BPUB | 2012-10-17 | 2012-10-31 | ||||||
| PPUB | 2012-12-11 | 2013-02-28 | ||||||
471 kB
127 kBProject
IEC 60191-6-22 Ed. 1.0
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
Remark:
Project plan - CDV: 2013-03 FDIS: 2013-12