International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47DWG2Mr. Hirofumi NakajimaPPUB2012-122022

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/782/NP  
2010-08-27 
ANW
47D/801/RVN  
2011-04-082011-01-15
1CD
47D/802/CD  
2011-05-272011-06-30
ACDV
47D/811/CC  
47D/811A/CC  
2011-09-142011-10-15
CCDV
47D/812/CDV  
47D/812F/CDV  
2011-11-242011-12-31
APUB
47D/820/RVC  
2012-05-182012-07-31
DEC
2012-10-052012-11-30
BPUB
2012-10-172012-10-31
PPUB
2012-12-112013-02-28

Project

IEC 60191-6-22 Ed. 1.0

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

 

Remark:

Project plan - CDV: 2013-03 FDIS: 2013-12