International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 02 | Hirofumi NAKAJIMA | PPUB | 2010-01 | 2014 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW |
| 2006-12-15 | ||||||
| ANW |
| 2007-08-24 | 2007-04-30 | |||||
| 1CD |
| 2007-12-21 | 2007-12-31 | |||||
| ACDV |
| 2008-05-09 | 2008-04-30 | |||||
| CCDV |
| 2008-09-26 | 2008-08-31 | |||||
| CCDV |
| 2008-10-24 | ||||||
| ADIS |
| 2009-03-20 | 2009-05-31 | |||||
| DEC | 2009-08-26 | 2009-05-31 | ||||||
| RDIS | 2009-09-01 | 2009-09-15 | ||||||
| CDIS |
| 2009-10-02 | 2009-11-30 | |||||
| APUB |
| 2009-12-09 | 2009-12-15 | |||||
| BPUB | 2009-12-10 | 2009-12-31 | ||||||
| PPUB | 2010-01-07 | 2010-01-31 | ||||||
1085 kBProject
IEC 60191-6-18 Ed. 1.0
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Remark:
- Targets - CDV: 2008-08 FDIS: 2009-06; [2/06035] - IEC/PAS 60191-6-18