International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 02 | Hirofumi NAKAJIMA | PPUB | 2011-02 | 2015 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| PNW |
| 2006-04-14 | ||||||
| ANW |
| 2006-08-25 | 2006-08-31 | |||||
| 1CD |
| 2007-06-15 | 2007-04-30 | |||||
| CDM |
| 2007-10-12 | 2007-10-31 | |||||
| A2CD |
| 2008-08-22 | 2007-12-31 | |||||
| 2CD |
| 2008-08-22 | 2008-08-31 | |||||
| ACDV |
| 2009-01-23 | 2008-12-31 | |||||
| CCDV |
| 2009-08-28 | 2009-10-31 | |||||
| ADIS |
| 2010-02-26 | 2010-04-30 | |||||
| DEC | 2010-08-30 | 2010-05-31 | ||||||
| RDIS | 2010-08-31 | 2010-09-15 | ||||||
| CDIS |
| 2010-11-05 | 2010-11-30 | |||||
| APUB |
| 2011-01-12 | 2011-01-15 | |||||
| BPUB | 2011-01-13 | 2011-01-31 | ||||||
| PPUB | 2011-01-27 | 2011-02-28 | ||||||
760 kB
91 kBProject
IEC 60191-6-17 Ed. 1.0
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Remark:
- Targets extended for 1CD: 2007-04 - SMB/3500/DL - cc: TC 40
Associated Documents:
SMB/3445B/INF
SMB/3500/DL