International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

SC 47D02Jun-ichi OHNOPPUB2007-092014

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/582/NP pdf file 252 kB
2004-04-23 
ANW
47D/591/RVN pdf file 161 kB
2004-08-272004-09-15
CCDV
47D/620/CDV pdf file 230 kB
2005-04-082005-06-30
ADIS
47D/663/RVC pdf file 146 kB
2006-08-252005-12-15
DEC
2007-01-092006-10-31
RDIS
2007-01-152007-01-31
CDIS
47D/681/FDIS
2007-04-132007-04-15
APUB
47D/692/RVD pdf file 101 kB
2007-06-182007-07-15
BPUB
2007-06-192007-07-15
PPUB
2007-06-272007-09-15

Project

IEC 60191-6-13 Ed. 1.0

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

 

Remark:

- US No: 2/03031 - Targets FDIS: 2006-10, IS: 2007-08 approved SMB/3298A/INF

 

Associated Documents:

SMB/3298A/INF