International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D02Hirofumi NakajimaPPUB2011-062016

History

Stage
Document
Downloads
Decision Date
Target Date
AMW
47D/752/MCR pdf file 40 kB
2009-08-21 
1CD
47D/763/CD pdf file 405 kB
2010-01-082009-09-30
ACDV
47D/768/CC doc file 105 kB
pdf file 209 kB
47D/768A/CC doc file 105 kB
pdf file 208 kB
2010-04-302010-05-31
CCDV
47D/784/CDV pdf file 397 kB
pdf file 381 kB
47D/784F/CDV pdf file 381 kB
2010-10-082010-06-30
APUB
47D/795/RVC doc file 94 kB
pdf file 204 kB
2011-04-012011-06-15
DEC
2011-04-012011-06-30
BPUB
2011-04-052011-04-30
PPUB
2011-06-082011-08-31

Project

IEC 60191-6-12 Ed. 2.0

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

 

Remark:

CDV: 2010-05 FDIS: 2011-02