International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| SC 47D | 02 | Hirofumi Nakajima | PPUB | 2011-06 | 2015 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||||
|---|---|---|---|---|---|---|---|---|
| AMW |
| 2009-08-21 | ||||||
| 1CD |
| 2010-01-08 | 2009-09-30 | |||||
| ACDV |
| 2010-04-30 | 2010-05-31 | |||||
| CCDV |
| 2010-10-08 | 2010-06-30 | |||||
| APUB |
| 2011-04-01 | 2011-06-15 | |||||
| DEC | 2011-04-01 | 2011-06-30 | ||||||
| BPUB | 2011-04-05 | 2011-04-30 | ||||||
| PPUB | 2011-06-08 | 2011-08-31 | ||||||
40 kB
105 kBProject
IEC 60191-6-12 Ed. 2.0
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
Remark:
CDV: 2010-05 FDIS: 2011-02