International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

SC 47D01Ichiro ANJOPPUB2007-092014

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
47D/530/NP pdf file 221 kB
2003-02-07 
ANW
47D/548/RVN pdf file 132 kB
2003-05-302003-06-30
CCDV
47D/592/CDV pdf file 103 kB
2004-08-272003-12-31
NADIS
47D/609/RVC pdf file 116 kB
2005-02-10 
ACDV
47D/609/RVC pdf file 116 kB
2005-02-112005-02-28
CCDV
47D/610/CDV pdf file 92 kB
2005-02-182005-02-28
NADIS
47D/622/AC pdf file 72 kB
2005-04-262005-04-30
ACDV
2005-04-262005-05-31
CCDV
47D/625/CDV pdf file 318 kB
2005-06-102005-06-30
ADIS
47D/664/RVC pdf file 125 kB
2006-08-252006-02-15
DEC
2007-03-302006-10-31
RDIS
2007-05-022007-04-15
CDIS
47D/687/FDIS
2007-05-112007-06-30
APUB
47D/697/RVD pdf file 99 kB
2007-07-202007-07-15
BPUB
2007-07-212007-07-31
PPUB
2007-07-252007-08-31

Project

IEC 60191-2 am16 Ed. 1.0

Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

 

Remark:

- Prev PROJ was IEC 60191-2/F57, will become outline 177E - US No: 02123. The 2nd CDV has been withdrawn as per decision at Munich mtg 2005-04-26 (see 47D/622/AC) - FDIS: 2006-10 IS: 2007-08 approved SMB/3298A/INF

 

Associated Documents:

SMB/3298A/INF