International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 04 | T Koizumi | PPUB | 2007-05 | 2013 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2006-07-21 | ||||
| ANW |
| 2007-01-26 | 2006-12-15 | |||
| DEC | 2007-02-01 | 2007-02-15 | ||||
| BPUB | 2007-02-27 | 2007-02-28 | ||||
| PPUB | 2007-05-30 | 2007-05-15 | ||||
593 kBProject
IEC/PAS 61249-3-1 Ed. 1.0
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Remark:
- JPCA-BM03-2006 - To be issued as PAS and also IEC PR in // - Intended to become future IEC 61249-3-1