International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub

Date

Stability

Date

TC 9104T KoizumiPPUB2007-052013

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/616/NP pdf file 593 kB
2006-07-21 
ANW
91/644/RVN pdf file 137 kB
2007-01-262006-12-15
DEC
2007-02-012007-02-15
BPUB
2007-02-272007-02-28
PPUB
2007-05-302007-05-15

Project

IEC/PAS 61249-3-1 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

 

Remark:

- JPCA-BM03-2006 - To be issued as PAS and also IEC PR in // - Intended to become future IEC 61249-3-1