International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 

Detail

Committee
Working Groups
Project Leader

Current

Status

Frcst Pub
Date

Stability

Date

TC 9103Kuniaki TAKAHASHI/ Tomoya KIGAPPUB2008-122017

History

Stage
Document
Downloads
Decision Date
Target Date
PNW
91/530/NP pdf file 394 kB
2005-06-24 
ANW
91/583/RVN pdf file 126 kB
2006-03-172005-11-15
1CD
91/614/CD pdf file 479 kB
2006-07-142006-09-30
ACDV
91/696/CC pdf file 115 kB
2007-06-152006-11-30
CCDV
91/708/CDV pdf file 788 kB
2007-08-102007-07-31
ADIS
91/775/RVC pdf file 131 kB
2008-07-042008-04-15
DEC
2008-07-292008-09-15
RDIS
2008-08-052008-08-15
CDIS
91/802/FDIS

2008-08-292008-10-31
APUB
91/825/RVD pdf file 99 kB
2008-11-042008-10-31
BPUB
2008-11-052008-11-15
PPUB
2008-11-272008-12-15

Project

IEC 62137-1-3 Ed. 1.0

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

 

Remark:

- Targets - CD: 2006-09 CDV: 2007-03 FDIS: 2008-03 - Liaison IPC, cc: TC 40, 47, 48, 104 and ISO TC 44