International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
Detail
Committee | Working Groups | Project Leader | Current Status | Frcst Pub Date | Stability Date |
|---|---|---|---|---|---|
| TC 91 | 03 | Kuniaki TAKAHASHI/ Tomoya KIGA | PPUB | 2008-12 | 2014 |
History
Stage | Document | Downloads | Decision Date | Target Date | ||
|---|---|---|---|---|---|---|
| PNW |
| 2005-06-24 | ||||
| ANW |
| 2006-03-17 | 2005-11-15 | |||
| 1CD |
| 2006-07-14 | 2006-09-30 | |||
| ACDV |
| 2007-06-15 | 2006-11-30 | |||
| CCDV |
| 2007-08-10 | 2007-07-31 | |||
| ADIS |
| 2008-07-04 | 2008-04-15 | |||
| DEC | 2008-07-29 | 2008-09-15 | ||||
| RDIS | 2008-08-05 | 2008-08-15 | ||||
| CDIS |
| 2008-08-29 | 2008-10-31 | |||
| APUB |
| 2008-11-04 | 2008-10-31 | |||
| BPUB | 2008-11-05 | 2008-11-15 | ||||
| PPUB | 2008-11-27 | 2008-12-15 | ||||
394 kBProject
IEC 62137-1-3 Ed. 1.0
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
Remark:
- Targets - CD: 2006-09 CDV: 2007-03 FDIS: 2008-03 - Liaison IPC, cc: TC 40, 47, 48, 104 and ISO TC 44